Table 3, J-STD-012 Projects - Work in Progress

Project Number

Assigned Number

Description of Activity

Status

P101

J-STD-026

Semiconductor design standard for flip chip application

Released

P102

J-STD-027

Mechnical outline standard for flip chip or chip scale configurations

Working draft 95%

P103

J-STD-028

Performance standard for flip chip/chip scale bumps

Released

P104

J-STD-029

Test methods for chip scale and bga products and assembly

Working draft 95%

P105

Flip chip/chip scale carrier trays(JEDEC)

JC 11.5

P106

Bare dice as flip chip or chip scale configuration management standard(JEDEC)

JC 11.4

P107

IPC-2225

Design standard for single and multiple chip package printed boards

Released

P108

IPC-6015

Performace requirements for single and multiple chip package printed board structures

Released

P109

IPC-

Qualification and performance standard for flip chip inorganic mounting structures

Not started HM-840?

P110

IPC-TM-650

Test methods for qualification and evaluation of flip chip mounting structures

Defined in HDI docs

P111

IPC-7076

IPC-7078

Requirements for chip scale/chip size component package mounting

Requirements for flip chip component package mounting(DCA)

Working draft First proposal

P112

IPC-

Standard for flip chip/chip scale assembly performance requirements

Not started

P113

Add to J-STD-029

Test methods for qualification and evaluation of flip chip/chip scale assemblies

Working draft 80%

P114

IPC-

Standard for flip chip/chip scale assembly rework and repair

Not started

P115

IPC-

Flip chip/chip scale assembly reliability standard

Not started

P116

J-STD-030

Qualification and performance of flip chip underfill materials

Proposal

P117

Qualification and performance of flip chip passivation materials

Not started

P118

Qualification and performance of flip chip encapsulation materials

Not started

P119

Qualification and performance for adhesives used in flip chip assembly

Not started

P120

J-STD-004