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　　2.2 TSOP(Thin Small Outline Package): IC腳與SOP相同, 但本體厚度較SOP薄。 TSOP(Thin Small Outline Package): The shape is similar to SOP, but it’s thinner than SOP.

　　2.3 SOJ(Small Outline J-leaded Package): IC腳位于本體兩側, 呈J型向內彎曲。SOJ(Small Outline J-leaded Package): IC leads are J-shape and locate in 2 sides of body.

　　2.4 bga(Ball Grid Array): IC腳呈球狀, 位于電路板(PCB)正下方。

　　2.5 μbga(Micro Ball Grid Array): IC腳呈球狀, 位于芯片(Chip)正下方, 無電路板(PCB)。 μbga(Micro Ball Grid Array): IC leads are solder ball and in the bottom side of chip, no PCB in μbga.

　　2.6 QFP(Quad Flat Package): IC腳位于本體四邊, 呈L型向外延伸。QFP(Quad Flat Package): IC leads are L-shape and locate in 4 sides of b12/1/2008ody.

　　2.7 PLCC(Plastic Leaded Chip Carrier): IC腳位于本體四邊, 呈J型向內彎曲。PLCC(Plastic Leaded Chip Carrier): IC leads are L-shape and locate in 4 sides of body.

　　PTH零件識別(PTH Components Distinguish)

　　一 電阻(Resistor)

　　PTH電阻之色碼代表意義如下:The meaning of color bar in PTH resistor is as below: