IPC-M-109 Component H ling Manual

　　元件處理手冊

　　IPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification Nonhermetic Solid State Surface Mount Devices

　　非密封固態表面貼裝器件濕度/再流焊敏感度分類

　　IPC/JEDEC J-STD-033A H ling, Packing, Shipping an d Use of Moisture/Reflow Sensitive Surface Mount Devices

　　對濕度、再流焊敏感表面貼裝器件的處置、包裝、發運和使用

　　IPC/JEDEC J-STD-035 Acoustic Microscopy Non-Hermetic Encapsulated Electronic Components

　　非氣密封裝電子元件用聲波顯微鏡

　　IPC-DRM-18G Component Identification Desk Reference Manual

　　零件分類標識手冊

　　IPC-DRM-smt-C Surface Mount Solder Joint evaluation Desk Reference Manual

　　接插件焊接點評價手冊

　　IPC-DRM-40E Through-Hole Solder Joint evaluation Desk Reference Manual

　　接插件焊接點評價手冊

　　IPC-DRM-56 Wire Preparation & Crimping Desk Reference Manual

　　導線和端子預成形參考手冊

　　IPC-DRM-53 Introduction to Electronics Assembly Desk Reference Manual

　　電子組裝基礎介紹手冊

　　IPC-M-103 St ards Surface Mount Assemblies Manual

　　所有SMT標準合訂本

　　IPC-M-104 St ards Printed Board Assembly Manual

　　10種常用印制板組裝標準合訂本

　　IPC-TA-722 Technology Assessment of Soldering

　　錫焊技術精選手冊

　　IPC-TA-723 Technology Assessment H book on Surface Mounting

　　表面安裝技術精選手冊

　　IPC-TA-724 Technology Assessment Series on Clean Rooms

　　清潔室技術精選系列

　　IPC-SM-780 Component Packaging a nd Interconnecting with Emphasis on Surface Mounting

　　以表面安裝為主的元件封裝及互連導則

　　IPC-SM-785 Guidelines Accelerated Reliability Testing of Surface Mount Attachments

　　表面安裝焊接件加速可靠性試驗導則

　　IPC-9701 Per mance Test Methods a nd Qualification Requirements Surface Mount Solder Attachments

　　表面安裝錫焊件性能試驗方法與鑒定要求

　　IPC/JEDEC-9702 Monotonic Bend Characterization of Board-Level Interconnects

　　平板互連的單一彎曲特性

　　IPC-PD-335 Electronic Packaging H book

　　電子封裝手冊

　　IPC-7525 Stencil Design Guidelines

　　網版設計導則

　　IPC-QL 365A Certification of Facilities That Inspect/Test Printed Boards, Components a nd Materials

　　印制板, 元件和材料檢驗/試驗企業的授證

　　IPC-9191 General Guidelines Implementation of Statistical Process Control

　　統計過程控制導則

　　IPC-TR-581 IPC Phase III ControlLED Atmosphere Soldering Study

　　IPC第3階段受控氣氛焊接研究

　　IPC-MI-660 Incoming Inspection of Raw Materials Manual

　　原材料接收檢驗手冊

　　IPC/EIA J-STD-004A Requirements Soldering Fluxes-Includes Amendment 1

　　錫焊焊劑要求(包括修改單1)

　　IPC/EIA J-STD-005 Requirements Soldering Pastes-Includes Amendment 1

　　焊膏技術要求(包括修改單1)

　　IPC-HDBK-005 Guide to Solder Paste Assessment

　　焊膏性能評價手冊

　　IPC/EIA J-STD-006A Requirements Electronic Grade Solder Alloys a nd Fluxed a nd Non-Fluxed Solid Solders 電子設備用電子級錫焊合金、帶焊劑及不帶劑整體焊料技術要求

　　IPC-SM-817 General Requirements Dielectric Surface Mounting Adhesives

　　表面安裝用介電粘接劑通用要求

　　ELEC-SOLDER Modern Solder Technology Competitive Electronics Manufacturing

　　電子制造的最新焊接技術

　　IPC-WP-006 Round Robin Testing & Analysis: Lead-Free Alloys-Tin, Silver, & Copper

　　無鉛焊料合金錫-銀-銅的試驗和分析求

　　IPC-CA-821 General Requirements Thermally Conductive Adhesives

　　導熱膠粘劑通用要求

　　IPC-3406 Guidelines Electrically Conductive Surface Mount Adhesives

　　表面貼裝導電膠使用指南

　　IPC-3408 General Requirements Anisotropically Conductive Adhesives Films

　　各向異性導電膠膜的一般要求

　　IPC-CC-830B Qualification a nd Per mance of Electrical Insulating Compound Printed Wiring Assemblies

　　印制板組裝電氣絕緣性能和質量手冊

　　IPC-HDBK-830 Guideline Design, Selection a nd Application of Con mal Coatings

　　敷形涂層的設計，選擇和應用手冊

　　IPC-SM-840C Qualification a nd Per mance of Permanent Solder Mask - Includes Amendment 1

　　永久性阻焊劑的鑒定及性能(包括修改單1)

　　IPC-HDBK-840 Guide to Solder Paste Assessment

　　焊膏性能評價手冊

　　ELEC-MICRO H book of Lead Free Solder Technology Microelectronic Assemblies

　　微電子組裝無鉛焊接技術手冊

　　IPC-TP-1114 The Layman’s Guide to Qualifying a Process to J-STD-001

　　基于J-STD-001組裝工藝雷氏選擇法

　　IPC-AJ-820 Assembly & Joining Ha ndbook

　　裝聯手冊

　　IPC-7530 Guidelines Temperature Profiling Mass Soldering (Reflow & Wave) Processes

　　大規模焊接(回流焊與波峰焊)過程溫度曲線指南

　　IPC-TP-1090 The Layman’s Guide to Qualifying New Fluxes

　　新型助焊劑雷氏選擇法

　　IPC-TP-1115 Selection Implementation Strategy a Low-Residue No-Clean Process

　　低殘留不清洗工藝的選擇和實施

　　IPC-S-816 SMT Process Guideline & Checklist

　　表面安裝技術過程導則及檢核表

　　IPC-TR-460A Trouble-Shooting Checklist Wave Soldering Printed Wiring Boards

　　印制板波峰焊故障排除檢查表

　　IPC-CM-770E Component Mounting Guidelines Printed Boards

　　印制板元件安裝導則

　　IPC-7912A Calculation of DPMO & Manufacturing Indices Printed Board Assemblies

　　印制板和電子組裝件每百萬件缺陷數(DPMO)和制造指數的計算

　　IPC-9261 In-Process DPMO Estimated Yield PWAs

　　印制板組裝過程中每百萬件缺陷數(DPMO)及合格率估計

　　IPC-DPMO-202 IPC-7912/9261 End Item In Process DPMO Set

　　IPC-7912A 和IPC-9261合訂本

　　IPC-9500-K Assembly Process Component Simulations, Guidelines & Classifications Package

　　組裝過程中元件仿真, 規則分類

　　IPC-9501 PWB Assembly Process Simulation evaluation of Electronic Components 電子元件的印制板組裝過程模擬評價

　　IPC-9502 PWB Assembly Soldering Process Guideline Electronic Components 電子元件的印制板組裝焊接過導則

　　IPC-9503 Moisture Sensitivity Classification Non-IC Components 非集成電路元件的濕度敏感度分級

　　IPC-9504 Assembly Process Simulation evaluation of Non-IC Components (Preconditioning Non-IC Components)

　　非集成電路元件的組裝過程模擬評價(非集成電路元件預處理)

　　IPC-9850-K Surface Mount Placement Equipment Characterization-KIT

　　表面貼裝設備性能檢測方法的描述(附Gerber格式CD盤)

　　IPC-9850-TM-KW, IPC-9850-TM-K Test Materials Kit Surface Mount Placement Equipment St ardization

　　表面貼裝設備性能測試用的標準工具包

　　• 4 IPC-9850 Placement Accuracy Verification Panels

　　• 1 IPC-9850 CMM Measurement Verification Panels

　　• 150 IPC-9850 QFP-100 Glass Components

　　• 130 IPC-9850 QFP-208 Glass Components

　　• 150 IPC-9850 bga-228 Glass Components

　　• NIST Traceable Measurement Certificate

　　• Custom Storage Case

　　IPC-7711/21A 電子組裝件的返工與返修

　　IPC/EIA J-STD-002B Solderability Tests Component Leads, Terminations, Lugs, Terminals Wires

　　元件引線、端子、焊片、接線柱及導線可焊性試驗

　　IPC/EIA J-STD-003A Solderability Tests Printed Boards

　　印制板可焊性試驗

　　IPC-TR-461 Trouble-Shooting Checklist Wave Soldering Printed Wiring Boards

　　印制板波峰焊故障排除檢查表

　　IPC-TR-462 Solderability evaluation of Printed Boards with Protective Coatings Over Long-term Storage

　　帶保護性涂層印制板長期貯存的可焊性評價

　　IPC-TR-464 Accelerated Aging Solderability evaluations

　　可焊性加速老化評價(附修訂)

　　IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability

　　蒸汽老化器溫度控制穩定性聯合試驗

　　IPC-TR-465-2 The Effect of Steam Aging Time a nd Temperature on Solderability Test Results

　　蒸汽老化時間與溫度對可焊性試驗結果的影響

　　IPC-TR-465-3 evaluation of Steam Aging on Alternative Finishes, Phase IIA

　　替代涂覆層的蒸汽老化評價

　　IPC-TR-466 Technical Report: Wetting Balance St ard Weight Comparison Test

　　技術報告: 潤濕天平稱重標準對比測試

　　SMC-WP-001 Soldering Capability White Paper Report

　　可焊性工藝導論

　　SMC-WP-005 PCB Surface Finishes

　　印制電路板表面清洗